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More about DDR3 memory
SourceNew DDR3 DIMMs from Super Talent Boast VLP Design
Offer green memory alternative
There's is an ongoing effort in the computer hardware industry to provide customers with new, energy-efficient products that can deliver performance without taking a major toll on the energy bill. A number of companies have recently unveiled such solutions, which fall in a new category of products, also known as “green.” On that note, memory maker Super Talent Technology has recently announced the debut of a new line
of green DDR3 modules that have been designed to use 38% less PCB material and 47% less packaging material, compared to the company's standard DDR3 DIMMs.
“Our goal with these green DDR3 DIMMs is to offer a greener memory choice for regular desktops that uses less raw materials, produces less industrial waste and consumes less fuel to transport with absolutely no tradeoffs in functionality or price,” explained Super Talent Director of Marketing Joe James. “When multiplied by the hundreds of thousands of memory modules we produce monthly, this can have an enormous environmental impact.”
The new VLP (very low profile) DDR3 memory modules have been designed for new desktop computer systems and will be available alongside the company's previously released VLP solutions for servers. The modules are expected to become available in 1GB and 2GB capacities and are 18.8mm tall, as opposed to regular ones, which are only 30.1mm. This design feature is said to make the memory modules 'greener', the company says.
According to Super Talent, the first green 1066 and 1333 MHz 1GB and 2GB DIMMs are expected to begin shipping in September. Unfortunately the company did not provide any specific details regarding the pricing of these new modules, but we should know more when they come to market. Considering their green features, these modules should make for an ideal choice for a future HTPC system, based on the latest platforms from Intel or AMD.
SourceCorsair's New 8GB and 12GB DDR3 Kits Ready for Intel's Core i7 and Core i5
Designed to support Intel's next-generation Lynnfield processors
Corsair, one of the world's leading vendors of high-performance memory solutions, has recently announced the introduction of a couple of new memory products, specifically designed to deliver support to the upcoming Intel P55 platform and the next-generation Core i5 and Core i7 processors. These new memory modules have been made available in capacities of 8GB and 12GB kits, enabling support for Intel's next generation of desktop processors. In addition, for increased performance, these new
modules have been equipped with the company's proprietary DHX+ cooling technology, with the new American Racing Blue fins and highlights.
“Windows 7 early adopters and other power users have recently been demanding 8GB and 12GB performance memory solutions to optimize their computing experience,” stated John Beekley, vice president of Technical Marketing at Corsair. “These 8GB and 12GB configurations will allow these advanced users to get the most out of their high performance rigs, particularly if they often switch between demanding tasks like gaming and video production.”
According to the Fremont, California-based memory maker, the new memory kits have been made available in both dual-channel and triple channel configurations, enabling support for all of Intel's high-performance platforms. The dual-channel configuration, part number CMD8GX3M4A1600C8, is designed with four matched 2GB modules, optimized for the upcoming P55 motherboards, some of which have already started to make their debut. The CMD12GX3M6A1600C8 triple-channel configuration has been designed with matched 2GB modules for high-end X58 platforms. Both memory sets have been certified for Intel' XMP profiles and boast 1600MHz speeds and CAS latency settings of 8-8-8-24.
Unfortunately, the memory vendor hasn't revealed any details regarding the availability and pricing of its new DDR3 memory kits. However, we have a strong feeling that they will be made available sometime around the official release of Intel's new platform.