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#31
Normally, I would agree, but I'm having enough of a heat problem, that I can not do with the computer the very thing that I updated to this build for...encoding. Therefore if it requires spending more to make it work, I shall.
Normally, I would agree, but I'm having enough of a heat problem, that I can not do with the computer the very thing that I updated to this build for...encoding. Therefore if it requires spending more to make it work, I shall.
Did you have any thoughts about my comments about the possibility of their being too much airflow, thus impeding proper cooling of your CPU? Can you turn down the fans or shut at least one down and then test to ensure that you aren't starving the CPU heatsink from the air it needs?
I considered it, but since I'm a retired pilot, with a good knowledge of aerodynamics, which relates to this issue better than thermo dynamics, I do not tend to feel that the idea will work. Yet, I have not discarded it, simply put it on hold for the moment, and will experiment with it some later. For thermo dynamics to work in the fashion needed in this case, it would require sufficient airflow through the cooler. I do not believe that excessive airflow would hinder cooling, if anything, it would improve it. The Bernoulli Principle states that when a liquid or gas is sped up, that the pressure is decreased, and in turn, the temperature decreased. The only way that would not necessarily be true is if the mass is sped up to near supersonic speeds, where a heating due to compression comes into play.
The only thing that I can see where airspeed could play a part in the problem, is if somehow, in a fashion that I do not understand, the airflow is being obstructed or detoured to a path other than intended.
It's less aero and thermodynamics in an enclosed space such as a tower. It becomes a strange matter of fluid dynamics. Something such as the venturi principle could very well apply if there is more air moving around your cooler, thus making it unavailable for the CPU fan to suck in.
Theoretically, fluid and aerodynamics operate the same. EDIT: With the exception that a gas is compressible and a fluid is not.
EDIT: I suppose that if there was a very high speed airflow across the intake of the fan, it could disturb airflow into the fan, but airspeeds in a case are not that high. Once air enters the fan, it would cross the cooling fins, and would receive thermal energy as designed. The only exception that I can think of, is if after passing through the fan, the air is diverted from taking a path directly across the fins, and go at an angle that shortens the path of exposure. This is a normal aspect of airflow that is near the edge of an airfoil (at least with an airfoil shaped as a wing. With a flat fin, not so much so, but still to a point), but not across the majority of the surface.
Yes, but aerodynamics apply better in an open space, and fluid applies better in an enclosed space, but yes, they are very similar :)
The only way that I can see that it matters as far as whether the space is open or enclosed, as far as liquid/gas behavior, is the compressibility factor that I mentioned in the edits above. However I believe that compression is a minor factor in the topic of discussion.
EDIT: Another thought occurred to me...with masses such as these, another trait that differs is viscosity, which may be a factor in surface adhesion, but if the surface is smooth, such as a cooler fin, that viscosity shouldn't impart anything strange to the airflow pattern.
Sorry, never use the stuff.
Another type of cooler that I had hoped would be more readily available by now, is the Danamics liquid metal coolers. However, after Googling, it seems that they have not gone fast track in the market yet. I think that is partly due to the fact that they restricted their market to Europe, and it is not available in the USA, which never made much sense to me. The part that I like best, is that it doesn't require any fans. In my case, it is not so much of a noise issue, as it is space. It appears that it would sit along side my chipset HS/F without any problems.
From what I have found with regular air coolers, the only ones that appear would fit the space better are those shaped in a circular array, which seems would allow more space from the other HS/F to fit under it.