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#1
Haswell info
Don't know if anyone else has seen this but it is starting to look real good for the next build.
Haswell: Cheat Sheet | TechRepublic
Haswell info
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Posts : 21,004 Desk1 7 Home Prem / Desk2 10 Pro / Main lap Asus ROG 10 Pro 2 laptop Toshiba 7 Pro Asus P2520 7 & 10
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New #2
As long as your not into heavy overclocking then they will be fine. I have been keeping a close eye on 2 forums where lots of members now have the K series and they are getting very high heat with anything over 4.4ghz, many chips won't OC to past 4.5ghz either.
Paul.
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Posts : 21,004 Desk1 7 Home Prem / Desk2 10 Pro / Main lap Asus ROG 10 Pro 2 laptop Toshiba 7 Pro Asus P2520 7 & 10 Thread StarterNew #3
I don't OC Paul but that is worth knowing as that chip I was always given to believe that these were going to run that much cooler as I was intending having a go at it when I build. Now I'm not so sure of what to do..
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New #4
I've been taking a hard look at Haswell systems, especially the ASUS MOBOs, to see how they compare to my present build (which I'm not replacing—I've too much money tied up in it—but I was curious to see if I was wise to go ahead and build when I did instead of waiting). The X87 Deluxe Dual, X87 WS, and X87 Deluxe, in that order, especially caught my attention. They could meet my needs, albeit barely, but I have concerns about the CPU itself.
Intel is using a TIM between the chip and the heat spreader, like they did with the Ivy Bridges, instead of soldering, like the Sandy Bridge-E and earlier. The Ivy Bridge CPUs have had problems with the chips overheating due to poor heat transfer from the chip to the heat spreader, resulting in many owners delidding them so the TIM can be replaced. The new Haswell CPUs are also not soldered and there already has been a handful of early user reports about them running hot.
I don't regret going with an X79 build instead of waiting for the Z87s. I needed a new desktop back when I built mine. I would have had to wait at least five months for the Haswells (my two top choices still aren't available yet) and it's always fiscally wise to not be a first adopter of anything since the first runs are usually buggy so I would have wound up waiting a year and wound up with a system that wouldn't have been much better than what I have now (albeit less expensive, though). Still, it's interesting to see what is, and is going to be, out there.
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New #5
Thanks for the link John, that's pretty interesting. I haven't really read too much about the new Haswell processors and this really shined some light on them for me. The overheating problem and lack of OCing potential is a little depressing though.
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New #6
The market for those who want to clock over 4.5 is a very small so I don't think that will be a concern to Intel.
Having a much faster cpu using a lot less power to me is the big step forward.
I will be watching as time goes on of any cooling problems.
Time will only tell.
If the facts are really facts about the better use of battery life it will be a great improvement. This improvement along should reach out and grab market share.
Us procrastinators will just wait and see.
Thanks for the information ICit2lol!
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New #7
I've heard that the reason why intel uses TIM instead of solder is because the chips are too small for heat to disperse evenly, so the solder is cracking/lifting and so limiting surface contact. Don't quote me on that though.
If that is true, then all Intel has to do is to make the chips bigger, preferably by adding more cores (maybe we can see 16-core haswell-E processors?)
That being said, I'm looking forward to building a tiny gaming computer using the i7-4770R with iris pro. It won't knock your socks off, but it will handle all the games I like.
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New #8
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Posts : 21,004 Desk1 7 Home Prem / Desk2 10 Pro / Main lap Asus ROG 10 Pro 2 laptop Toshiba 7 Pro Asus P2520 7 & 10 Thread StarterNew #9
Hum making me have second thoughts now I was sorts attracted by the RAM speed specs on the boards and I suppose when you think about it logically because the architecture is so small heat is going to be even more of an issue.
By that I mean on the actual die for example the minute connections and components that I assume are in the tiniest sizes one would care to think about would be very vulnerable to currents applied to them.
For example say a 10v x 10 amp current passed through a 10mm wire might cause it to get warm pass that same current through a 1mm may possibly melt it. After all it doesn't require O2 for melting to occur.
The heat spreader issue also seems to me one that the manufacturers have rushed into I would prefer to pay a tad more to know that the chip is fully in contact with the entire heat spreader.
Plus we also have to remember we are paying a reasonably good prices for these devices.
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New #10
Here is a small article from today on Haswell and heat - Haswell heat surprises system builders | bit-tech.net
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