Show Us Your Rig [4]

essenbe said:

I've been reading that the tim Intel used is great stuff. The problem is the glue. It keeps the IHS from making good contact with the die.

I heard exactly the same Steve

paulpicks21 said:

essenbe said:

I've been reading that the tim Intel used is great stuff. The problem is the glue. It keeps the IHS from making good contact with the die.

I heard exactly the same Steve

It has to be true then. Besides, I read it on the internet. That means it's true, nobody lies on the internet. lol.

essenbe said:

paulpicks21 said:

essenbe said:

I've been reading that the tim Intel used is great stuff. The problem is the glue. It keeps the IHS from making good contact with the die.

I heard exactly the same Steve

It has to be true then. Besides, I read it on the internet. That means it's true, nobody lies on the internet. lol.

Absolutely! I heard it from a friend, I believe the friend found out from the internet, so I have no shadow of doubt that it's 100% true!

essenbe said:

paulpicks21 said:

essenbe said:

I've been reading that the tim Intel used is great stuff. The problem is the glue. It keeps the IHS from making good contact with the die.

I heard exactly the same Steve

It has to be true then. Besides, I read it on the internet. That means it's true, nobody lies on the internet. lol.

I know of a guy that removed the glue and replaced it with a shim made of paper the same thickness as the glue. He then used NT-H1 on the die and on top of the IHS. The results were almost the same as he got before de-lidding, proving that it is not the paste that is bad but the gap between the die and the IHS.

tw33k said:

I know of a guy that removed the glue and replaced it with a shim made of paper the same thickness as the glue. He then used NT-H1 on the die and on top of the IHS. The results were almost the same as he got before de-lidding, proving that it is not the paste that is bad but the gap between the die and the IHS.

The experiment would only be conclusive if he used the same TIM that Intel used on the IHS. I did some research on gallium and found it is also a liquid metal or a main component of liquid metal compounds replacing mercury.

Wikipedia said:

Gallium-containing alloys are very corrosive when hot. Its temperature should not exceed 65°C.

That's not a good quality though. Source
I've received several packages from OZ to the US and it's always been 12-15 days minimum.

@Steve/Paul, is the glue you refer to that which is on the perimeter of the IHS?

The Liquid Ultra has arrived so tomorrow I'll take the lid off (a little nervous)

tw33k said:

The Liquid Ultra has arrived so tomorrow I'll take the lid off (a little nervous)

Ya think? Good luck. Pictures!

A Guy

P.S. Be careful

tw33k said:

The Liquid Ultra has arrived so tomorrow I'll take the lid off (a little nervous)

Yes, good luck, and snap a pic or two.

tw33k said:

Britton30 said:

@Mark: Good luck on de-lidding the i7 and not cutting you fingers. I have rad the heat spreader is not soldered on so hopefully it comes off without pulling the die with it.

It's not soldered which is why there are temp problems with these chips. I have a really thin, sharp blade that will cut through the glue no problem. I'm then using CoolLabs Liquid Ultra between the die and the IHS and between the IHS and the H100. They sent the Liquid Ultra 8 days ago so it should be here very soon (I hope) I can't get it locally so had to order it from the US.

Who's said that was hard job to do?