STACK_COMMAND: kb
FOLLOWUP_NAME: MachineOwner
MODULE_NAME: [COLOR="Red"]GenuineIntel[/COLOR]
IMAGE_NAME: GenuineIntel
DEBUG_FLR_IMAGE_TIMESTAMP: 0
IMAGE_VERSION:
FAILURE_BUCKET_ID: [COLOR="red"]X64_0x124_GenuineIntel_PROCESSOR_TLB[/COLOR]
BUCKET_ID: X64_0x124_GenuineIntel_PROCESSOR_TLB
[Memory Device (Type 17) - Length 28 - Handle 001bh]
Physical Memory Array Handle 001ah
Memory Error Info Handle 001dh
Total Width 64 bits
Data Width 64 bits
Size 2048MB
Form Factor 0dh - SODIMM
Device Set [None]
Device Locator DIMM0
Bank Locator BANK 0
Memory Type 18h - Specification Reserved
Type Detail 0080h - Synchronous
Speed 1067MHz
Manufacturer [String Not Specified]
Serial Number
Asset Tag Number
Part Number [COLOR="Red"]9905428-010.A01LF[/COLOR]
[Memory Device (Type 17) - Length 28 - Handle 001fh]
Physical Memory Array Handle 001ah
Memory Error Info Handle 0021h
Total Width 64 bits
Data Width 64 bits
Size 1024MB
Form Factor 0dh - SODIMM
Device Set [None]
Device Locator DIMM1
Bank Locator BANK 2
Memory Type 18h - Specification Reserved
Type Detail 0080h - Synchronous
Speed 1067MHz
Manufacturer [String Not Specified]
Serial Number
Asset Tag Number
Part Number [COLOR="red"]M471B2873EH1-CF8[/COLOR]

samsung
Module Number: 2
Module Size: 1024 MBytes
Memory Type: DDR3 SDRAM
Module Type: SO-DIMM
Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
Module Manufacturer: Samsung
Module Part Number: M471B2873EH1-CF8
Module Revision: 0
Module Serial Number: 323450948
Module Manufacturing Date: Year: 2009, Week: 47
Module Manufacturing Location: 1
SDRAM Manufacturer: Samsung
Error Check/Correction: None
Module characteristics
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Module Density: 1024 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V
Module timing
Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
CAS# Latencies Supported: 6, 7, 8
Minimum CAS# Latency Time (tAAmin): 13.125 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
Minimum Row Precharge Time (tRPmin): 13.125 ns
Minimum Active to Precharge Time (tRASmin): 37.500 ns
Supported Module Timing at 533.3 MHz: 7-7-7-20
Supported Module Timing at 466.7 MHz: 7-7-7-18
Supported Module Timing at 400.0 MHz: 6-6-6-15
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
Features
Partial Array Self Refresh (PASR): Not Supported
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Not Supported
Extended Temperature 1X Refresh Rate: Not Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Pseudo Target Row Refresh (pTRR): Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Kingston
Module Number: 0
Module Size: 2048 MBytes
Memory Type: DDR3 SDRAM
Module Type: SO-DIMM
Memory Speed: 533.3 MHz (DDR3-1066 / PC3-8500)
Module Manufacturer: Kingston
Module Part Number: 9905428-010.A01LF
Module Revision: 0
Module Serial Number: 2435783312
Module Manufacturing Date: Year: 2011, Week: 10
Module Manufacturing Location: 4
SDRAM Manufacturer: Unknown
Error Check/Correction: None
Module characteristics
Row Address Bits: 14
Column Address Bits: 10
Number Of Banks: 8
Module Density: 1024 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Module Nominal Voltage (VDD): 1.5 V
Module timing
Minimum SDRAM Cycle Time (tCKmin): 1.875 ns
CAS# Latencies Supported: 5, 6, 7, 8
Minimum CAS# Latency Time (tAAmin): 13.125 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.125 ns
Minimum Row Precharge Time (tRPmin): 13.125 ns
Minimum Active to Precharge Time (tRASmin): 37.500 ns
Supported Module Timing at 533.3 MHz: 7-7-7-20
Supported Module Timing at 466.7 MHz: 7-7-7-18
Supported Module Timing at 400.0 MHz: 6-6-6-15
Supported Module Timing at 333.3 MHz: 5-5-5-13
Minimum Write Recovery Time (tWRmin): 15.000 ns
Minimum Row Active to Row Active Delay (tRRDmin): 7.500 ns
Minimum Active to Active/Refresh Time (tRCmin): 50.625 ns
Minimum Refresh Recovery Time Delay (tRFCmin): 110.000 ns
Minimum Internal Write to Read Command Delay (tWTRmin): 7.500 ns
Minimum Internal Read to Precharge Command Delay (tRTPmin): 7.500 ns
Minimum Four Activate Window Delay Time (tFAWmin): 37.500 ns
Features
Partial Array Self Refresh (PASR): Not Supported
On-die Thermal Sensor (ODTS) Readout: Not Supported
Auto Self Refresh (ASR): Supported
Extended Temperature 1X Refresh Rate: Not Supported
Extended Temperature Range: Supported
Module Temperature Sensor: Not Supported
Pseudo Target Row Refresh (pTRR): Not Supported
Module Nominal Height: 29 - 30 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm